FIELD: electronic engineering; semiconductor microelectronics. SUBSTANCE: integrated circuit has insulating board carrying metallization pattern on its face side and bonding screen on underside and is provided with hole and metal base with ridge. Board hole has contraction on height of 1-300 mcm from face side of board. Ridge is located in wide part of hole. Contact pads of chip to be grounded are connected to ridge through hole contraction filled with electricity and heat conducting material. Wide part of hole measures 0.2x0.2 mm up to chip size and distance between side walls of ridge and those of wide part of hole is 0.001-1,0 mm. EFFECT: improved electric and heat-dissipating characteristics, extended operating frequency range, facilitated manufacture. 3 cl, 1 dwg
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