METHOD FOR MOUNTING SEMICONDUCTOR DEVICE CHIP Russian patent published in 1999 - IPC

FIELD: mounting chips within hybrid integrated circuit substrate or in package base of device. SUBSTANCE: depression of size exceeding that of chip is made on locating surface. Chip is gripped by means of gripping tool provided with flat butt end and capillary hole expanding towards its butt end and positioned above depression. Prior to press- fitting the chip into depression the latter is filled with metered portion of adhesive. Chip is press-fitted into adhesive until portion of flat end of tool protruding beyond chip is stopped by locating surface. Press- fitting is ceased as soon as front surface of chip is set flush with surface carrying mentioned depression; then gripping tool is disengaged. EFFECT: facilitated procedure and improved precision of setting the chip in position due to preventing substrate deformation. 8 cl, 4 dwg