FIELD: deposition of coatings by magnetron sputtering. SUBSTANCE: method includes inducing of movable magnetic field above surface of target by electromagnetic method. Produced above surface of target is rotating field by supply to electromagnetic coils of periodic AC voltages shifted in phase relative to each other in compliance with spatial location of coils. Device has flat target and magnetic system which consists of flat magnetic circuit located parallel to target surface, separate magnetic circuits directed towards target and attached to flat magnetic circuit and electromagnetic coil wound round each separate magnetic circuit. System has at least three separate magnetic circuits located at equal intervals from target center and from each other. EFFECT: higher uniformity of sputtering of flat target. 2 cl, 2 dwg
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Authors
Dates
1999-08-27—Published
1998-06-15—Filed