MICROWAVE HYBRID INTEGRATED CIRCUIT Russian patent published in 1999 - IPC

FIELD: semiconductor microelectronics. SUBSTANCE: underside or face side of IC board has metal-coated depression whose metal coat serves as lower plate of capacitor; remaining part of board under depression functions as capacitor insulator; its upper plate is located on face side of board and functions as part of metal coating configuration; thickness of remaining part of board in depression is 1-400 mcm. EFFECT: improved electrical characteristics and reduced mass and size of integrated circuit. 8 cl, 5 dwg