SOLUTION FOR ELECTROLYSIS-FREE COPPER PLATING, PROCESS OF ELECTROLYSIS-FREE COPPER PLATING Russian patent published in 2002 - IPC

FIELD: metallization of articles. SUBSTANCE: proposed solution for electrolysis-free copper plating has copper ion, complexing reagent, compound of hypophosphoric acid as reducer and metallic catalyst for initiation of reducing reaction, lithium ion and surface active substance of polyoxiethylene type. In addition there is proposed process of electrolysis-free copper plating with the use of mentioned solution and metallized article obtained as result of this process. Solution for electrolysis-free copper plating in agreement with invention secures deposition of homogeneous and needle-shaped copper film on surface on object and can be employed to raise adhesion strength between various metals and resins, adhesion of copper foil to resin which is used in such semiconductor circuits as multilayer printed circuit board or in copper plated laminate. EFFECT: increased efficiency of process. 9 cl, 4 dwg, 1 tbl