FIELD: processes for grinding and polishing surfaces of fragile plates used for making electronic products, for example of silicon and sapphire. SUBSTANCE: method comprises steps of preparing disposable paper gaskets; impregnating them with liquid; using as impregnating liquid suspension on base of surface-active matter with concentration of 5-10%; placing paper gaskets into seats of mounting board; placing plates upon paper gaskets and slightly forcing plates; creating preliminary pressure acting upon all plate and consisting 0.5-0.9 of pressure value necessary for working plates in order to provide simultaneous deformation of gaskets and laying of their working surfaces in the same plane. Part of paper mass penetrates to space between lateral surfaces of seats and plate and provides fluid tightness of their back sides. After working plates are released, paper gaskets are removed. EFFECT: simplified securing process, enhanced efficiency, improved quality of ready products, less number of rejected plates. 2 cl, 3 dwg
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Authors
Dates
2002-11-20—Published
1999-08-24—Filed