METHOD FOR MANUFACTURING MICROWAVE INTEGRATED CIRCUITS Russian patent published in 2003 - IPC

FIELD: electronic engineering; microwave integrated circuit production. SUBSTANCE: conducting strips of desired layout are formed by scanning substrate surface with laser beam of power P at speed v and covering these strips with protective layer upon their manufacture and formation of their layout picture. Maximum power of laser beam P_max and minimum scanning speed of laser beam v_min are interrelated by equation P_max/v_min = cpT_bS, where c is specific heat conductivity; p is density; T_b is boiling temperature of metal included in ceramic substrate composition; S is surface area of laser beam. In manufacturing large-scale integrated circuits high resolving power is maintained when forming their layout pattern. EFFECT: facilitated manufacture, reduced labor consumption. 2 cl