METHOD TO METALLISE ELEMENTS IN PRODUCTS OF ELECTRONIC ENGINEERING Russian patent published in 2011 - IPC H01L21/28 

FIELD: electricity.

SUBSTANCE: method to metallise elements in products of electronic engineering includes application of a sublayer of a metallising coating on one of substrate surfaces with previously formed topology of elements in an appropriate product, and this sublayer is a system of metals with the specified thickness, providing for adhesion of the main layer of the metallising coating, formation of topology - protective photoresistive mask of the main layer of metallising coating, local application of the main layer of the metallising coating, removal of protective mask, removal of a part of the sublayer arranged outside the topology of the main layer of the metallising coating. Application of the sublayer of the metallising coating is carried out with the total thickness of 0.1-0.5 mcm, directly onto the specified sublayer additionally a technological layer is applied from an easily oxidable metal with thickness of 0.1-0.5 mcm, and formation of the metallising coating topology is carried out on the technological layer from the easily oxidable metal. Prior to local application of the main layer of the metallising coating a part of the technological layer is removed from the easily oxidable metal via the specified protective mask, and removal of the remaining part of the technological layer from the easily oxidable metal is carried out prior to removal of a part of the sublayer of the metallising coating arranged outside the topology of the main layer of the metallising coating.

EFFECT: increased quality of the metallising coating and reliability of electronic engineering products, improved electrical characteristics, increased yield of good products.

6 cl, 3 dwg, 1 tbl