COMBINATION GRINDING METHOD Russian patent published in 2003 - IPC

FIELD: technological processes in machine engineering, namely deep peripheral grinding of material having tendency for occurring flaws such as burnouts and microcrackings at controlling heat flux directed to part. SUBSTANCE: method comprises steps of using builtup grinding wheel including body and cutting organs having peripheral abrasive layers with different grain size and joined with mechanisms for lengthwise and radial motion of them; performing rough, semifinish and finish grinding of blank due to changing discontinuity and grain size of working peripheral cutting surfaces of grinding wheel; performing rough grinding by means of helical intermittent large-grain cutting surface of wheel; performing semifinish grinding by means of continuous large-grain cutting surface formed at lengthwise motion of movable ends of annular cutting organ by means of mechanism for lengthwise motion; performing finish grinding by means of continuous small-grain movable peripheral surface that is fed at grinding process to grinding zone due to radial motion of annular cutting organ by means of mechanism for radial motion. Oscillation of grinding zone of rough cutting member and its discontinuity in lengthwise direction allow to intensify grinding modes, to lower thermal stresses at grinding process, to enhance vibration proofness and dynamic balancing. EFFECT: shortened additional time periods due to changing rough mode to semifinish mode and then to finish mode without interruption of grinding process, enhanced efficiency of method. 14 dwg, 1 ex