FIELD: microelectronics; manufacture of thin-film resistors for microassemblies. SUBSTANCE: thin-film resistors are manufactured by evaporation, double photolithography, and etching methods. Resistive layer and multilayer conducting structure are evaporated on substrate. Conductors and contact pads are obtained upon first photolithography and etching of structure. Second photolithography involves coating of all conductors and contact pads, except for pads covering resistors with conductors, and resistors being formed with photoresist layer. Then resistive layer is etched to form thin-film resistors. EFFECT: reduced manufacturing cost due to dispensing with gold in conducting structure. 1 cl, 2 dwg
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Authors
Dates
2003-09-27—Published
2002-02-18—Filed