METHOD OF SOLDERING TWO-LAYER SOLDERED STRUCTURES Russian patent published in 2019 - IPC B23K1/12 B23K1/19 B23K103/18 

FIELD: technological processes.

SUBSTANCE: invention can be used for soldering two-layer structures, in particular for the manufacture of housing for LRE combustion chambers consisting of an outer power shell made of steel or an alloy based on nickel, and an inner ribbed shell made of copper or a copper-based alloy. Heating the structure to the brazing temperature is carried out in two stages: first, to a temperature of 750 °C ± 10 °C for 30 minutes with a holding time at this temperature for 10 minutes, and then within 55 minutes bring the temperature up to 1000 °C ± 10 °C and incubated for 20 minutes. Cooling of the structure is also carried out in two stages: first, forced cooling to 400 °C, and then on the air.

EFFECT: by performing two-mode heating of the structure during continuous operation of the vacuum system, the total heating time of the structure is significantly reduced, which allows minimizing the penetration of Mn atoms into the surface layer of the copper envelope and reducing the soldering time.

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