FIELD: radio-electronics, possible use for manufacturing electronic boards used for making radio-electronic equipment.
SUBSTANCE: method includes subsequent application onto metallic plate with pass apertures of two-layered dielectric cover, consisting of aluminum oxide (copper oxide) and chromium oxide, and two-layered electro-conductive metallic cover, consisting of copper and nickel. Oxide-aluminum and oxide-copper covers are produced in galvanic manner, while oxide-chromium and electro-conductive metallic covers are produced from gas phase by thermal decomposition of metal-organic compounds.
EFFECT: possible production of electronic boards which are good for soldering and have stable technical characteristics, also having value of penetration voltage 560≤U≤600 Volts and with specific electric resistance ρ≥1·1012 Ohm·cm.
3 ex
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