INTEGRATED CIRCUIT MANUFACTURING PROCESS Russian patent published in 2005 - IPC

FIELD: microelectronics; integrated circuit manufacture.

SUBSTANCE: manufacturing process for k integrated circuit includes installation of n components on common dielectric base having external leads. Then sealing compound is applied to components so that it covers them and spreads over surface of common dielectric base provided with external leads and is restrained thereon due to surface tension forces. Single workpiece produced in the process is divided into parts to obtain k integrated circuits. This group method for manufacturing integrated circuits makes it possible to dispense with use of special integrated-circuit package forming auxiliaries.

EFFECT: facilitated manufacture.

1 cl, 2 dwg