CERAMIC BOARD, COMPOSITION OF ITS COATING, AND METHOD FOR PRODUCING THE LATTER Russian patent published in 2006 - IPC H01L23/00 B22F7/00 C04B41/81 

FIELD: electronic industry.

SUBSTANCE: proposed ceramic board can be used for producing electronic and semiconductor devices, as well as integrated circuits, designing of substrates and boards of large-scale integrated circuits, including metal deposition on aluminonitride ceramics. Proposed method enables designing base architecture of boards which makes it possible to make blanks of boards of arbitrary configuration ready for metal deposition using various structural materials and metal deposition proper without essential re-adjustment of process equipment. Use is made of composite layer with preset linearly and/or nonlinearly varying content of insulating and conducting materials.

EFFECT: improved properties of coatings, minimized size of electronic parts, newly designed integrated circuits and devices having steady electrical characteristics.

56 cl, 11 dwg, 1 ex