METHOD OF MAKING BOARDS BASED ON ALUMINUM NITRIDE WITH TRANSITION HOLES Russian patent published in 2019 - IPC C23C28/02 

FIELD: manufacturing technology.

SUBSTANCE: invention relates to production of boards based on aluminum nitride with transition holes and can be used in electronic, electrical and radio engineering industry, in particular, in production of metallized boards for power modules. Method of making boards based on aluminum nitride with transition holes involves deposition of titanium-copper thin film consisting of titanium and copper deposited on it onto a surface of a ceramic plate. Thin-film layer of titanium-copper is coated with a thin-film layer of chemical nickel, a metal coating pattern is formed by photolithographic etching on a thin-film layer of chemical nickel. In said transition holes copper inserts with height less than thickness of ceramic plate by value of not more than thickness of solder, then to nickel-coated sections of thin-film layer, intended for operation at increased current loads, under pressure of 0.01–0.03 kgf/mm² appliques are pressed from copper foil and soldered by silver-copper soldering in vacuum or hydrogen medium.

EFFECT: enabling combination in one technological process of making boards for high-power products with execution of part of elements from copper of large thickness and part of elements by etching in thin-film metallization.

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