METHOD OF METALIZING CERAMIC SUBSTRATES Russian patent published in 2024 - IPC C23C28/02 C25D3/46 H05K3/18 

FIELD: technological processes.

SUBSTANCE: invention relates to production of metal coatings on ceramic plates and can be used in the electronic, electrical and radio engineering industries in the production of, for example, metallized substrates for power modules, microwave transistors and microcircuits. Method involves vacuum deposition of a titanium layer and a copper layer on the surface of a ceramic substrate, subsequent application of a galvanic silver layer and subsequent thermal treatment in a vacuum medium. Titanium layer is deposited with thickness of 0.1–0.5 mcm. Copper layer is deposited with thickness of 1–3 mcm. Layer of silver is deposited on the copper layer and subsequent heat treatment is carried out until the layers of copper and silver are completely melted, at which a coating is formed on a substrate, which is a copper-silver alloy with a given melting point. Thickness of the deposited silver layer is selected based on the composition of the copper-silver alloy with a given melting point of the coating.

EFFECT: obtaining metallized ceramic substrates based on aluminum oxide, aluminum nitride and other materials with high adhesion, which reaches and even exceeds the cohesion strength of the substrate material.

1 cl, 1 tbl