FIELD: power electronics.
SUBSTANCE: proposed power semiconductor module package is assembled of two electrically insulated components attached to one another. First of mentioned package components has at least two holes to pass power leads and depression in the form of slit. At least two isolating walls between holes are provided on package surface perpendicular to the latter. One isolating wall is part of second package component out of mentioned ones; it is inserted into depression in first mentioned package component; at least one second wall out of mentioned isolating walls is part of first package component. Isolating walls placed between holes passing two power leads provide for compact arrangement of leads.
EFFECT: enhanced electric strength of module package insulation, improved cutoff voltage characteristics.
5 cl, 4 dwg
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