FIELD: thin-film resistor manufacturing processes.
SUBSTANCE: proposed method includes evaporation of current-conducting layer onto ceramic substrate by way of ion-plasma spraying and heat treatment in open air. Then, minimum in 12 h after evaporation, blanks obtained are given heat treatment at temperature of 630 to 720 °C for 30 to 60 minutes, and TCR is measured. This temperature should be of above-zero value.
EFFECT: improved operating characteristics of resistor units due to their enhanced temperature and electric loading capacity.
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