FIELD: microsystem manufacturing method and device.
SUBSTANCE: proposed method for manufacturing microsystems with cavities formed at several levels in main body produced by photo-hardened material involves insertion of electronic parts intercoupled by electric conductivity into mentioned cavities. Layer-by-layer production of main body is continued upon disposition of electronic part in cavity; in the process vertically rising electricity-conductive structure is formed above contact pads of electronic part to afford direct connection between next part and that disposed above electronic part, or else conductive junction is made between electricity conductive material rising from contact pad and one or more next electronic parts disposed at certain distance on side of electronic part. Layer-by-layer production of microsystem is conducted between at least one pair of rolls, area between rolls being filled with photo-hardened liquid; this liquid layer is exposed through one of rolls and respective mask. Device designed for implementing this method is also proposed.
EFFECT: ability of interconnecting separate electronic parts at a time while producing microstructure.
11 cl, 7 dwg
