FIELD: mechanical engineering.
SUBSTANCE: bumper contains a mobile power-absorbing shock plate and a motionless basis coupled by a system of telescopic cylindrical devices jointed in parallel with located cylindrical springs arranged concentrically, the above shock plate and basis being mounted on the body front part. Each of telescopic devices is enveloped outwardly by a cylindrical spring and provided additionally with the lever mechanism arranged coaxially there inside in the form of consecutively linked four-link hinge parallelograms, the levers being made from a plastic metal with cellular structure, the circular recess on the basis and a latch on the shock plate to accommodate the telescopic device and to fix it in compressed and extended states, respectively. Transverse diagonals of the hinge parallelograms exceed the telescopic device cylinder inner diameter in compressed state and is lower than its minimum diameter in extended state, respectively.
EFFECT: higher power absorption.
3 dwg
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Authors
Dates
2008-07-10—Published
2007-01-09—Filed