SYSTEM OF WIRING SOLID STATE CHIP TO CASE BASE Russian patent published in 2008 - IPC H01L21/52 

FIELD: electrical engineering.

SUBSTANCE: invention relates to production of LSIs and VLSIs with a large area of ships by flux-free soldering in vacuum, hydrogen, argon, forming gas etc. and can be used in assembling silicon chips in the silicon solid state unit cases by soldering using various solders. The proposed system of wiring the solid state chip to the case base comprises a silicon chip and a copper case with a buffer element arranged there between to make a soldered seam. The buffer element represents a screen, its lower side being made of a set of copper wires and its upper side a set of wires made in Mo, W or their alloys. Note that the screen lower side is arranged in the case base equal-side trapezoidal grooves, their bottom size making 1.0d, top side being equal to 1.2d and depth making 1.0d, where d is the screen lower side wire diameter and the screen top upper side wire diameter is selected subject to preset soldered seam thickness.

EFFECT: reduction of dry seams, soldered seam higher strength, better heat sink, reduced thermal strains in chip-soldered seam-cases system.

2 dwg