METHOD OF MANUFACTURING OF THICK-FILM STRUCTURE ON BASIS OF HIGH-TEMPERATURE SUPERCONDUCTOR Russian patent published in 2009 - IPC H01L39/24 

Abstract RU 2352025 C1

FIELD: physics.

SUBSTANCE: method of manufacturing of thick-film structure on the basis of high-temperature superconductor includes application of intermediate layer on substrate and thick film of high-temperature superconductor of a bismuthic system (Bi,Pb)-Sr-Ca-Cu-O. As the intermediate layer, the layer coinciding on composition with thick film of high-temperature superconductor, transited stages of prestress drying and heat treatment is used at temperature 886°C before its full fusion.

EFFECT: improvement of qualitative performances of thick-film HTSC structures and curing time reduction of basic HTSC layer which leads to formation of its superconducting properties, by introduction in structure of intermediate stratum of the same composition at maintenance of adhesion of the intermediate stratum to substrate and the basic stratum to the intermediate.

1 dwg

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RU 2 352 025 C1

Authors

Volik Nina Nikolaevna

Grigorashvili Jurij Evgen'Evich

Dates

2009-04-10Published

2007-07-31Filed