METHOD OF ALIGNING MULTI-CRYSTAL MODULE ELEMENTS FOR CAPILLARY ASSEMBLY AND DEVICE TO THIS EFFECT Russian patent published in 2010 - IPC H05K3/00 

FIELD: electronics engineering.

SUBSTANCE: invention relates to electronic engineering, particularly, to instrument making, namely, to development and production of microelectronic hardware of alignment and soldering of densely packed microelectronic components including multi-crystal modules (MCM). Proposed method allows aligning multi-crystal modules for capillary assembly, that is, aligning three systems of contacts arranged on three carriers, i.e. chip + switching substrate + carrier capillaries between chip and substrate. Also, to exploit advantages of MCM capillary assembly process, vacuum soldering is used with controlled chip clamping to substrate in compliance with preset cyclogram. Proposed device comprises base supporting opto-mechanical system of aligning opposite contacts of chips and switching substrate, two-coordinate table with manipulators to control switching substrate moves in horizontal plane along X and Y axes that is attached onto the table. It comprises also manipulator of chip vertical motion and rotation along axis Z effected with the help of rod with vacuum pincette arranged on its lower end face connected to vacuum pump. Note here that aforesaid unit incorporates horizontal motion drive allowing to reach process pan accommodating chips, grip the latter in turns and bring them into alignment zone, and place them onto switching substrate. The latter is fixed on aforesaid two-coordinate table. Proposed device incorporates also double prism of opto-mechanical system, colour video camera and colour display, units of vacuum fixation of chips and switching substrate. Note here that aforesaid units are fixed on two-coordinate table and connected to vacuum pump via independent channels.

EFFECT: higher efficiency.

14 cl, 58 dwg