FIELD: physics.
SUBSTANCE: invention relates to methods for provision of quality and reliability of integral circuits (IC), and may be used for comparative assessment of IC batches reliability both at the stage of production and in process of acceptance testing in enterprises that manufacture radio-electronic equipment. Arbitrary samples of integral circuits from batches are taken, and dynamic parametres values are measured in them before and after action of five electrostatic discharges that vary in voltage polarity, which is maximum permissible by technical conditions, and temperature annealing is carried out at maximum permissible temperature of crystal, and electrostatic discharges are sent to each of terminal pairs of integral circuit: inlet-common point, outlet - common point, supply - common point, inlet - outlet, number of electrostatic discharges and temperature annealing cycles is at least three, number of failed integral circuits is used to make conclusion on comparative reliability of integral circuit batches.
EFFECT: development of non-destructive check method and improvement of its functionality.
2 tbl
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Authors
Dates
2010-04-20—Published
2008-11-11—Filed