FIELD: chemistry.
SUBSTANCE: method of making silicon dioxide film involves feeding tetramethoxysilane and oxygen in a stream of inert gas into a reaction zone in volume ratio of tetramethoxysilane to oxygen equal to 1:5-10, decomposition of tetramethoxysilane vapour in the presence of oxygen and deposition of a silicon dioxide film on plates at temperature of 380-500°C at atmospheric pressure for 10-30 minutes. The film is deposited on quartz or silicon plates.
EFFECT: uniform silicon dioxide film is obtained with low power consumption and without use of toxic substances.
3 cl, 2 ex
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Authors
Dates
2010-09-10—Published
2008-12-30—Filed