FIELD: physics.
SUBSTANCE: substrate with a mask in form of a film-type layer is heated in an inert medium until melting of island elements contained in the mask image, where material of the mask does not wet the surface of the substrate. The method for lift-off lithography of film-type island structures on a substrate includes the following steps: formation of a mask island layer, melting the mask island layer, sputtering a layer of second material, removal of the mask island layer, sputtering a third material and removal of the second material. Material of the first layer is selected such that it is does not wet the surface of the substrate.
EFFECT: identical reduction of dimensions of contact mask elements on the entire surface of the substrate.
4 cl, 2 dwg
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