HYBRID MICROCIRCUIT FASTENING ELEMENT Russian patent published in 2010 - IPC H01L23/18 

FIELD: physics.

SUBSTANCE: hybrid microcircuit fastening element consists of two or more platforms lying on the peripheral region of an array of indium microcontacts made on the surface of a semiconductor substrate. The platforms are made from indium, have a given size, are rectangular and have area which is at least four times greater than the area of the indium microcontacts. The indium rectangular platforms are at a certain distance from each other.

EFFECT: more than twice increase in the number of thermal cycles for cooling microcircuits from room temperature to temperature of liquid nitrogen, which does not lead to destruction of the indium microcontacts, and simplification and reduction of the cost of the technological process.

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