FIELD: electrical engineering.
SUBSTANCE: invention relates to an assembly technology of semiconductor devices and can be used to hybridize LSI reading chips and the photosensitive element matrix (PSEM) by an inverted mounting method. Method for manufacturing microcontacts according to the invention comprises applying an indium film and forming an array of indium microcontacts in the form of rectangles by a photolithographic method, in this case, when mating the chips in each cell of the chips to be mated, more than one rectangular indium microcontact is arranged.
EFFECT: invention provides an increase in the strength of the chips mating due to the relative increase in the share of the side mating of the microcontacts area in the total area of the microcontacts mating.
1 cl, 2 dwg, 1 tbl
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