COPPER ALLOY Cu-Si-Co FOR MATERIALS OF ELECTRONIC TECHOLOGY AND PROCEDURE FOR ITS PRODUCTION Russian patent published in 2011 - IPC C22C9/06 C22F1/08 H01B1/02 

Abstract RU 2413021 C1

FIELD: metallurgy.

SUBSTANCE: copper alloy for materials of electronic technology consists from 1.0 to 2.5 wt % Ni, from 0.5 to 2.5 wt % Co and from 0.30 to 1.2 wt Si, the rest is copper and unavoidable impurities. Median value ρ is 20-60 wt %, mean square deviation is σ (Ni+Co+Si) ≤30 wt %, share of area of surface of particles of the second phase S of dimension 0.1 mcm or more and 1 mcm or less observed in cross section parallel to direction of rolling is 1-10 %.

EFFECT: production of alloy of high strength, electric conductivity and quality of press forming.

7 cl, 3 tbl

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RU 2 413 021 C1

Authors

Ehra Naokhiko

Kuvagaki Khirosi

Dates

2011-02-27Published

2008-08-22Filed