Cu-Ni-Si-Co-Cr COPPER ALLOY, USED IN ELECTRONIC COMPONENTS, METHOD OF ITS MANUFACTURING AND ELECTRONIC COMPONENT IMPLEMENTED FROM THIS ALLOY Russian patent published in 2009 - IPC C22C9/06 C22F1/08 

FIELD: metallurgy.

SUBSTANCE: invention relates to Cu-Ni-Si-Co-Cr copper alloys for electronic components. Alloy contains from about 0.5 up to 2.5 wt % Ni, from about 0.5 up to 2.5 wt % Co, from about 0.30 up to about 1.2 wt % Si, from about 0.09 up to about 0.5 wt % Cr, the rest is Cu and unavoidable admixtures. Ratio of total mass of Ni and Co to mass of Si fill formula about 4 ≤ [Ni+Co]/Si ≤ about 5, and ratio of Ni to Co is about 0.5 ≤ Ni/Co ≤ about 2, and in which Pc is equal or less than about 15/1000 mcm², and Pc/P is equal or less than about 0.3, where P - number of inclusions, dispersed in alloy and allowing size 1 mcm or more, and Pc -number of dispersed inclusions, which allows size 1 mcm or more, concentration of carbon in which is 10 wt % or more. Method of obtaining of alloy includes following stages: heating of ingot during 1 hour or more at temperature about 900 °C or higher or up to temperature lower than about 1000 °C, hot rolling at temperature about 650°C or higher; cold rolling; thermal treatment on solid solution during from about 5 up to about 3600 s at temperature from about 850 up to about 1000 °C; strengthening at deterioration during from about 1 up to 10 hours at temperature from about 350 up to about 550 °C.

EFFECT: received alloy allows increased durability and electroconductivity.

4 cl, 1 tbl, 31 ex