FIELD: printing industry.
SUBSTANCE: invention relates to method to manufacture a silicon substrate of a liquid ejection head, which is equipped with an element of energy generation to eject liquid and a hole passing through silicon substrate, to supply liquid to the generation element. Method of the substrate manufacturing includes the following stages: formation of multiple concave sections at the back surface of the silicon substrate with plane orientation {100}, besides, the concave sections are oriented towards the first surface and are aligned in rows in direction <100> of the first surface; and formation of multiple holes for liquid ejection by axial crystalline anisotropic etching at the silicon substrate via concave sections with the help of the etching fluid, etching speed of which on the plane {100} of the silicon substrate is less than the etching speed on the plane {110} of the silicon substrate.
EFFECT: improved accuracy of silicon sections manufacturing between holes along width.
6 cl, 38 dwg
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Authors
Dates
2011-04-20—Published
2009-12-18—Filed