FIELD: electricity.
SUBSTANCE: in power electronic unit, comprising a cooler, to heat-removing surface of which bases of electronic modules are pressed with edges with gaps arranged on them between each other with semiconductor crystals, which are in thermal contact with bases with installation of crystals on dielectric substrates, with filling of space between heat-removing surface of the cooler and bases of electronic modules with heat-conducting paste, on heat-removing surface of the cooler, under electronic modules, there are channels provided, with width that is not more than gaps between semiconductor crystals arranged under gaps between semiconductor crystals, besides, ends of channels are arranged outside the limits of electronic module bases.
EFFECT: increased capacity and reliability of power electronic unit due to increasing efficiency of electronic modules cooling by reduction of thermal resistance between bases of electronic modules and heat-removing surface of the cooler.
2 dwg
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Authors
Dates
2011-04-27—Published
2010-03-25—Filed