METHOD AND DEVICE TO MANUFACTURE CLEANED SUBSTRATES OR PURE SUBSTRATES EXPOSED TO ADDITIONAL TREATMENT Russian patent published in 2011 - IPC H01J37/36 H01J37/30 

Abstract RU 2423754 C2

FIELD: electricity.

SUBSTANCE: substrates cleaning with plasma etching is carried out on a plasma discharge plant, comprising a cathode source of electrons (5) and an anode structure (7). The anode structure (7) comprises, at one side, an anode electrode (9), and on the other side, a limiter (11), which is electrically isolated from it. The limiter (11) has a hole (13), directed towards the area (S) of the substrate (21) to be cleaned. Power supply to a cathode source of electrons (5) and an anode electrode (9) is sent via a supply circuit from a source of supply (19). The circuit is controlled in electric buffer mode.

EFFECT: provision of higher density of plasma etching directly near the cleaned area of the substrate and achievement of improved even cleaning both inside reliefs and of protruding parts on the considered area of the surface.

44 cl, 10 dwg

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RU 2 423 754 C2

Authors

Krassnittser Zigfrid

Gshtel' Oliver

Lendi Daniehl'

Dates

2011-07-10Published

2006-10-27Filed