FIELD: electricity.
SUBSTANCE: substrates cleaning with plasma etching is carried out on a plasma discharge plant, comprising a cathode source of electrons (5) and an anode structure (7). The anode structure (7) comprises, at one side, an anode electrode (9), and on the other side, a limiter (11), which is electrically isolated from it. The limiter (11) has a hole (13), directed towards the area (S) of the substrate (21) to be cleaned. Power supply to a cathode source of electrons (5) and an anode electrode (9) is sent via a supply circuit from a source of supply (19). The circuit is controlled in electric buffer mode.
EFFECT: provision of higher density of plasma etching directly near the cleaned area of the substrate and achievement of improved even cleaning both inside reliefs and of protruding parts on the considered area of the surface.
44 cl, 10 dwg
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Authors
Dates
2011-07-10—Published
2006-10-27—Filed