FIELD: electricity.
SUBSTANCE: operations of process chamber pumping, supply of oxygen, creation of plasma by electron beam coming in vicinity from object surface are performed in method of plasma anodisation for metal or semiconductive object. Hollow cathode is located opposite anodised object; negative voltage of 20-50 V is supplied to it and anodising is performed at pressure of oxygen of 5÷20 Pa.
EFFECT: increase in rate of oxygen layer growth at surface of metal or semiconductive objects at preservation of defect-free structure of layers.
1 dwg
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Authors
Dates
2012-01-10—Published
2010-08-04—Filed