FIELD: electricity.
SUBSTANCE: solution contains copper salt, deoxidant and surface-active component, and as the deoxidant it includes the lower aliphatic spirit such as methyl, ethyl, n-propyl or isopropyl spirit with the concentration 0.05÷2 mole/l of water solution. As a copper salt the solution can contain 0.02÷0.04 mole/l of copper chloride or 0.02÷0.6 mole/l of copper formiate. The solution is prepared just before the settling.
EFFECT: solution allows to metallise a dielectric surface at a high speed and to obtain continuous conductive copper paths conforming to the boards of 5 precision class.
7 cl, 14 dwg, 6 ex
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