FIELD: information technology.
SUBSTANCE: in one version, the method comprises steps from which, for each element, an identical backup element is established and like inputs of the backup elements are combined, wherein the backup elements used are logic elements which do not have memory; the backup elements are spaced apart by a distance greater than the size of area where the microchip is damaged by one radiation particle incident on it, and like outputs of the backup logic elements are combined to form pairs of backup elements, each representing a backed up logic element.
EFFECT: high fault-tolerance of large integrated systems when operating in radiation conditions.
6 cl, 4 dwg
Authors
Dates
2013-02-20—Published
2011-08-10—Filed