FIELD: physics.
SUBSTANCE: method of making a light-emitting device according to the invention comprises the following steps: providing a LED flip chip on a substrate, wherein the LED chip is located between the board and the substrate, the substrate being wider and longer than the LED chip; providing insulating lining material between the LED chip and the board and around the edges of the LED chip and the substrate; removing the substrate from the LED chip; placing an optical element on top of the open surface of the LED chip after the substrate is removed, wherein at least parts of the edges of the optical element lie inside the walls of the lining material; the optical element has a preformed shape before mounting; the length dimension of the optical element is smaller than that of the inner boundaries of the walls, and the width dimension of the optical element is smaller than that of the inner boundaries of the walls; all edges of the preformed optical element protrude beyond the edge of the LED chip. A light-emitting device according to the invention is also provided.
EFFECT: high radiation efficiency.
15 cl, 8 dwg
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Authors
Dates
2013-03-20—Published
2008-10-22—Filed