FIELD: process engineering.
SUBSTANCE: invention relates to laser processing and may be used for punching 10-30 mcm-dia micro holes for optical diaphragms, spatial filters and screens. Micro holes are punched by pulsed laser radiation focused to processed workpiece. Workpiece represents a plate of mother material with its both surfaces coated with layers of auxiliary material. Laser radiation of fs-band is used and displaced over workpiece surface in mutually perpendicular lines at intersections of which forms micro holes. Auxiliary layers are removed after processing.
EFFECT: micro holes with high quality of walls.
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