FIELD: radio engineering, communication.
SUBSTANCE: in the disclosed microwave adapters between layers of integrated circuits, a wedge-shaped vertical adapter in one case and terrace-shaped vertical adapter in another are placed symmetrically one below the other, each adapter including its own microcavities, and above said adapters there handing edges of film elements of working topologies with obtuse angles of a given value between them and walls of the microcavities.
EFFECT: miniaturisation of the complete system of logic elements with reduced loss of electromagnetic energy, distributing integrity on a third coordinate while arranging active topological microwave structures in layers.
12 dwg
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