FIELD: electrical engineering.
SUBSTANCE: invention can be used for making UHF-hybrid space-borne integrated microcircuits with multilevel commutation based on organic dielectric. Essence of the invention lies in the fact that the method of manufacturing the UHF hybrid integrated microcircuit chip with multi-level commutation based on an organic dielectric includes making a multilayer board with alternation of layers with metallized pattern and layers of organic dielectric with subsequent mounting of crystals, before which thermal treatment is carried out.
EFFECT: possibility of obtaining stable characteristics and temperature independence of characteristics of microwave signal of microwave-hybrid integrated microcircuit with multilevel commutation based on organic dielectric in frequency range from tens of megahertz to tens of gigahertz.
5 cl, 6 dwg
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