FIELD: electricity.
SUBSTANCE: invention relates to semiconductor light sources. According to the invention, a production method of structures of light-emitting diodes (LEDs) on one plate that includes the following is proposed: formation of a plate of a device with LED matrixes; disconnection of LED matrixes on the plate of the device; separation of LED matrixes in order to create gaps between LED matrixes; application of a continuously reflecting coating onto LED matrix surface and in gaps between LED matrixes; removal of the first parts of the reflecting coating from LED matrix surface; and fracture or separation of the reflecting coating in gaps between LED matrixes; with that, the second parts of the reflecting coating remain on lateral sides of LED matrixes so that edge emission can be controlled. Besides, another version of the LED production method is proposed, in which the reflection coating is made from a thin metal film.
EFFECT: reflecting coating applied onto lateral sides of LED matrixes provides the possibility of edge emission control, improvement of uniformity of light at variation of an angle and brightening-up.
27 cl, 17 dwg
