FIELD: process engineering.
SUBSTANCE: invention relates to production of metal microstructure with application of LIGA-technology, that is, lithography, electroplating and forming. Proposed method comprises the stages that follow. Ply of photosensitive resin is applied on conducting substrate to level resin ply surface to required depth. Resin play is irradiated via mask to dissolve unpolymerised section of resin ply. At least one metal ply is galvanically deposited on conducting surface sections to form electrically formed units that reach the resin ply top surface. Metal is being deposited on levelled resin ply surface to make metal jumpers to connection of said units. Resin ply and said units re separated from substrate to remove resin ply from said units. Said units are secured by their base end surface to working plate to subjected outer surfaces with jumpers to required depth of microstructures so that said units are separated. Formed metal microstructures are separated from metal plate.
EFFECT: higher precision of microstructure sizes.
8 cl, 4 dwg
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