METHOD OF MAKING BIMETALLIC MICROSTRUCTURE Russian patent published in 2013 - IPC C25D1/00 

FIELD: chemistry.

SUBSTANCE: substrate is prepared, on the conducting side of which a layer of photosensitive resin is deposited; the resin layer is irradiated through a mask with the outline of the required microstructure; unexposed areas of the resin are dissolved and the exposed zones re endowed with electrical conductivity; a layer of a first metal is uniformly electrodeposited on the conducting layer of the substrate and on the conducting side of the layer of the photosensitive resin, a layer of a second metal is similarly deposited to form a unit which rises to the level of the top surface of the layer of the photosensitive resin. The resin and the metal are treated on a plane to bring the resin and the obtained unit to the same level. The resin layer and the obtained unit are separated from the substrate by delamination. The layer of photosensitive resin is removed in order to free the formed microstructure.

EFFECT: method enables to obtain components with controlled high geometrical accuracy.

9 cl, 8 dwg