METHOD OF MAKING MICROPLATES WITH TRANSITION METALLIZED HOLES Russian patent published in 2019 - IPC H05K3/42 

FIELD: physics.

SUBSTANCE: invention can be used for creation of microwaves of microwave range of wavelengths with transient metalized holes (TMH). Technical result is achieved by the fact that in the method of making microboards with TMH, including laser formation of holes in a substrate from ceramics, cleaning of the substrate, metallization of holes and double-sided sputtering of conducting layers, galvanic deposition of metal layers and formation of a topological pattern by photolithographic etching, first, a protective absorbing layer of aluminium oxide-based suspension is applied on the substrate from the front side. Holes are sutured through the laser, the substrate is cleaned and metallization of the holes is carried out in the same vacuum technological cycle, and at the same time the sputtering layers of vanadium and copper are sputtered onto the front and back sides of the substrate by magnetron sputtering. Topological pattern is formed by creation of mask from negative photoresist on two sides of substrate by drawing and galvanic deposition in windows of mask layers of copper and gold with subsequent etching of vanadium and copper layers with free field of microplate surface.

EFFECT: technical result is broader technological capabilities of the method of making microboards with TMH, low electrical resistance and high reliability of compounds in microplates.

3 cl, 1 dwg