FIELD: process engineering.
SUBSTANCE: invention relates to application of coating on hot substrate in vacuum chamber. Substrate (20) is placed on holder (24) so that substrate lower surface (21a) stays in contact holder surface. Substrate (20) is lifted through distance d relative to holder. Lifted substrate is heated via its top surface (21b) with the help of heater (22). Coating is immediately applied on hot substrate to be lowered on holder (24) and substrate is cooled down. Said applicator comprises substrate holder (24) with substrate lifting device (23), substrate lower surface (21a) being located on holder (24). Heater (22) is used to heat lifted substrate (20) through its upper surface and means (29) to apply the coating on substrate (20) immediately after heating.
EFFECT: fast heating and cooling for immediate coat application in the same vacuum chamber.
24 cl, 6 dwg
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