FIELD: technological processes.
SUBSTANCE: invention relates to electronic devices containing one or more organic layers. A shaping method of an electronic device involves shaping on a carrying substrate of a variety of electronic-functional elements formed with a pile of layers, which contains the lower conducting layer, with that, the method involves a stage of shaping between the carrying substrate and the lower conducting layer of the non-conducting layer, which provides for increase of adhesion of the lower conducting layer to the carrying substrate, where the non-conducting layer includes a nitride layer containing less than 10 atomic percent of oxygen on the surface of boundary with the lower conducting layer.
EFFECT: invention allows improving reliability of electronic devices.
17 cl, 1 dwg
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Authors
Dates
2015-06-10—Published
2010-06-04—Filed