RADIOELECTRONIC DEVICE HOUSING (VERSIONS) Russian patent published in 2015 - IPC H05K5/04 H05K5/06 H05K7/20 

FIELD: radio engineering, communication.

SUBSTANCE: housing has a bottom, side walls and a cover and is made of material with a coefficient of thermal conductivity of not more than 50 W/m·K. There is a recess at the bottom of the housing in at least one area corresponding to a contact with at least one heat-dissipating radioelectronic element. An insert made of material with a coefficient of thermal conductivity of not less than 200 W/m·K, connected to the housing, is placed in the recess. Alternatively, an insert made of double-layer material is placed in the recess, the top layer being a layer of material identical to the material of the housing, connected to the housing by a welded joint, and the bottom layer is a layer of material with a coefficient of thermal conductivity of not less than 200 W/m·K. In the top layer of the double-layer material there is a recess which runs to the bottom layer of the double-layer material, which enables to place at least one heat-dissipating radioelectronic element on its surface.

EFFECT: providing intense heat removal from heat-dissipating radioelectronic elements when in contact with the bottom of the housing, while minimising heat transfer to the radioelectronic elements when housings are sealed by soldering or welding, which improves reliability and longevity of radioelectronic devices.

16 cl, 2 dwg