CONFIGURATION OF BRIDGING PLY FOR LED Russian patent published in 2015 - IPC H01L33/38 

FIELD: physics, optics.

SUBSTANCE: light-emitting diode comprises chip (40) with light-emitting semiconductor ply (20) produced by epitaxial growth on substrate and extending over the entire, in fact, LED chip. Note here that LED chip has top surface with current spreading ply (28) that covers the semiconductor ply. Besides, it has metal electrode pattern (42, 44, 46) on solely the top surface portion for current flow the LED for its supply. Note here that said electrode pattern comprises multiple metal terminals (42) on top surface their width some 2 to 10 times larger than terminal transmission length L_t where length is defined from the relationship relating surface resistance in Ohms per square of current spreading and contact impedance of interface of terminal and current spreading ply in Ohm/m². Note also that metal contacts interlocks, in fact, the light emitted by light emitting semiconductor ply. Note also that metal connections (44) between contact feature with smaller than 2L_t.

EFFECT: decreased contact resistance, better uniformity of current distribution without deterioration in light yield.

19 cl, 14 dwg