FIELD: process engineering.
SUBSTANCE: invention relates to microelectronics, particularly, to production of solid-state devices by evaporation of metal coating on the substrate back surface. Claimed process consists in that the substrate is flexed in reverse direction before evaporation of metal coating. It differs from known processes in that said coating is evaporated on substrate back surface through stencil with through holes shaped and sized to crystals. Jumpers between said holes in stencil are comparable with the width of division webs made between crystals on substrate face surface.
EFFECT: reduced residual thermomechanical strains at said boundary.
5 dwg
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