FIELD: chemistry.
SUBSTANCE: invention relates to production of metal coatings on ceramic articles and can be used in electronic, electrical and radio engineering. Method of metallisation of ceramics for soldering is carried out by application on its surface of coating by cold gas-dynamic sputtering (GDS) method, which includes supply of pre-heated compressed air into supersonic nozzle, introduction into the nozzle of powder material or mixture of powder materials, their acceleration into the nozzle by air flow. That way several layers of coating are formed on ceramic surface. According to the invention, the first layer material used is a mixture of copper and aluminium powders with a copper content in mixture of 10–20 %, then performing oxidative annealing in air at temperature 800–1100 °C for 3 hours, after application of second layer of copper powder with thickness of 300–700 mcm is heat treated in vacuum at temperature of 950–1050 °C for 5 hours.
EFFECT: disclosed method enables to obtain a coating with low coefficient of thermal expansion, high adhesion strength, high electrical conductivity, low thermal resistance of the multilayer structure, as well as high adhesion of coating to ceramics and possibility of subsequent multi-stage soldering during installation of power PPP, wire and beam leads and their welding to double-layer metal coating to obtain suitable metal-coated ceramic substrates.
1 cl, 2 ex
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Authors
Dates
2019-05-15—Published
2017-12-12—Filed